Symposium Q
Atomic Scale Processing – Bring Material Process to the Ultimate Precision
Robert Clark (TEL, Belgium)
Daehong Eom (Micron)
Steven George (Colorado, United States)
Adrian Mackus (TU/e, Netherlands)
Gregory Parsons (NCSU, United States)
Haozhe Harry Wang (Duke, United States)
Xiaohan Wu (Fudan University, China)
Bring together academic researchers, industry technologist in the material processing field to present latest development. Topics includes, but not limited by:
1. Atomic layer deposition (ALD)
2. Atomic layer etching (ALE)
3. Area-selective deposition (ASD)
4. Other atomic layer process (ALP): atomic layer anneal, atomic layer
5. Characterization techniques and metrology for atomic scale processing
6. Deposition and etching of 2D materials
7. AI driven in design of precursors, process development and material stacks for atomic-scale processing
Chair(s)
Richard Yang (Applied Angstrom Technology, Singapore)
W.M.M. (Erwin) Kessels (Eindhoven Uni. of Technology, The Netherlands)
Co-Chair(s)
Liu Hongfei (IMRE, Singapore)
Tan Chuan Seng (NTU, Singapore)
Andrew Kummei (UCSD, US)
Heeyeop Chae (Sungkyunkwan Uni., South Korea)
Scientific Advisor
Si-Young Choi (Pohang)
Correspondence
Yeng Ming Lam
Nanyang Technological University, Singapore
Email: ymlam@ntu.edu.sg