Flexible electronics has emerged as a cornerstone technology to enable numerous applications in the digital age. The last decade has witnessed an exponential growth in the fundamentals and technologies. Tremendous opportunities abound for applications. Yet, realizing the full potential of flexible electronics still faces significant challenges in translating lab-produced devices to industrially manufactured products.

To translate into real impact beyond scientific publication, this symposium will focus on progresses and challenges in device design, materials manufacturing, and system integration. Specifically, novel devices for sensing, computing, etc., fabrication and processing techniques for unconventional electronic materials, and emerging large-scale manufacturing platforms will be covered. In addition, integration efforts into various form factors (e.g., fabrics, skin patches, masks, implanted modules) will be reviewed, highlighting packaging issues especially interconnection and encapsulation. Engineering towards system functionality and reliability will be discussed, pinpointing real-world issues for deployment.

This symposium will cover both fundamental and technological topics relating to flexible electronics’ design, manufacturing, and integration, including but not limited to:

• Device design for specific applications
• Nanomaterial fabrication and device integration
• Polymer processing and high-density patterning
• Printed electronics
• Thin film manufacturing techniques
• 3D electronics manufacturing
• Large-area processing and array-type devices
• Flexible hybrid integration
• Integrated systems and applications
• Materials and techniques in interconnection and encapsulation for packaging
• System reliability engineering
• Clinical trials of flexible electronic devices

Information will be available soon!