Jong-Hyu Ahn (Yonsei University, Korea)
Wenlong Cheng (Sydney University, Australia)
Wei Gao (California Institute of Technology, United States)
Chuan Fei Guo (Southern University of Science and Technology, China)
Youfan Hu (Peking University, China)
Seokwoo Jeon (Korea University, Korea)
Ying Jiang (University of Macau, Macao)
Wen-Ya Lee (National Taipei University of Technology, Taiwan)
Jinxing Li (Michigan State University, United States)
Nan Liu (Beijing Normal University, China)
Nanshu Lu (University of Texas at Austin, United States)
Naoji Matsuhisa (University of Tokyo, Japan)
Marc Ramuz (Mines Saint-Étienne, France)
Hvacinthe Randriamahazaka (Université Paris Cité)
Jonathan Rivnay (Northwestern University, United States)
John Rogers (Northwestern University, United States)
Xuemei Sun (Fudan University, China)
Sihong Wang (The University of Chicago, United States)
Cheng Wen (Nanjing University, China)
Tomoyuki Yokota (University of Tokyo, Japan)
Cunjiang Yu (University of Illinois Urbana-Champaign, United States)
Xinge Yu (City University of Hong Kong, Hong Kong)
Yu-Qing Zheng (Peking University, China)

Flexible electronics has emerged as a cornerstone technology to enable numerous applications in the digital age. The last decade has witnessed an exponential growth in the fundamentals and technologies. Tremendous opportunities abound for applications. Yet, realizing the full potential of flexible electronics still faces significant challenges in translating lab-produced devices to industrially manufactured products.

To translate into real impact beyond scientific publication, this symposium will focus on progresses and challenges in device design, materials manufacturing, and system integration. Specifically, novel devices for sensing, computing, etc., fabrication and processing techniques for unconventional electronic materials, and emerging large-scale manufacturing platforms will be covered. In addition, integration efforts into various form factors (e.g., fabrics, skin patches, masks, implanted modules) will be reviewed, highlighting packaging issues especially interconnection and encapsulation. Engineering towards system functionality and reliability will be discussed, pinpointing real-world issues for deployment.

This symposium will cover both fundamental and technological topics relating to flexible electronics’ design, manufacturing, and integration, including but not limited to:

• Device design for specific applications
• Nanomaterial fabrication and device integration
• Polymer processing and high-density patterning
• Printed electronics
• Thin film manufacturing techniques
• 3D electronics manufacturing
• Large-area processing and array-type devices
• Flexible hybrid integration
• Integrated systems and applications
• Materials and techniques in interconnection and encapsulation for packaging
• System reliability engineering
• Clinical trials of flexible electronic devices